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Shimifrez has developed several manufacturing technologies that increase the resolution and improve the aperture quality and size in the sputtering deposition/shadow masks used extensively in the production of masks for depositing gold and silver traces onto quartz crystals and other microelectronic applications such as silicon deposits and TFT’s.

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Using Etching and electroforming process techniques, Shimifrez can now produce cost-effective, stainless steel nickel and Invar and nickel foil masks. The techniques combine low preparation costs with superior tolerances, delivering greater density designs with higher accuracy.

Both masks produced with electroforming or photo etching technology are burr-free, stress-free and completely flat whereas shadow masks produced by laser cutting, the alternative manufacturing method, are subjected to thermal deformation can cause stress and distortion in the material.

Shimifrez Benefits

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Delivery of your conctacts and connector in less than 5 days

Reduce the risk of hard tooling

Burr and stress-free components

Design changes and modifications can be done within hours.

Fast lead time for you to reduce your time to market

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  • Integrated Circuits
  • Thin Film Hybrid Devices
  • MEMS Devices
  • Discrete Semiconductor Devices
  • Pressure Transducers
  • Biomedical and Bioscience Devices
  • Solar and Photovoltaic Devices
  • Photo Detectors and Sensors
  • Optical Wave Guides
  • Optoelectronics
Shadow Masks
Contact us now

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We are eager to hear about your next project. We will get back to you within one business day!

Accepted file types: DWG, DXF, Step, Gerber, PDF, Corel Draw, Adobe Illustrator. Maximum file size 20MB.

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